| 摘要 |
A manufacturing method for a wireless device may involve placing a plurality of antennas on a plastic layer, wherein each of the antennas comprises one or more conductive loops positioned within an inner diameter and an outer diameter; placing a plurality of sensor chips on the plastic layer such that each sensor chip is interconnected to a respective antenna on the plastic layer and is positioned within the inner diameter and outer diameter of the respective antenna, wherein each sensor chip has a respective sensor facing away from the plastic layer and has respective electrical contacts interconnected with the respective antenna; and providing an encapsulation layer over the plurality of antennas and the plurality of sensor chips on the plastic layer. |
