发明名称 |
COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE WITH PLATING LAYER |
摘要 |
The present invention makes it possible to form a plating layer on the surface of a resin molded article obtained from a thermoplastic resin composition even without mixing a laser direct structuring additive into the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, said composition including an aqueous organic substance, water, and a laser direct structuring additive. Further provided are a kit that includes the composition for forming a laser direct structuring layer, and a method for producing a resin molded article with a plating layer. |
申请公布号 |
WO2016002660(A1) |
申请公布日期 |
2016.01.07 |
申请号 |
WO2015JP68536 |
申请日期 |
2015.06.26 |
申请人 |
MITSUBISHI ENGINEERING-PLASTICS CORPORATION |
发明人 |
SUGIYAMA MASAHIDE;YAMADA RYUSUKE;KIKUCHI TATSUYA;YAMANAKA YASUSHI |
分类号 |
C23C18/20;C08L101/12 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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