发明名称 COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE WITH PLATING LAYER
摘要 The present invention makes it possible to form a plating layer on the surface of a resin molded article obtained from a thermoplastic resin composition even without mixing a laser direct structuring additive into the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, said composition including an aqueous organic substance, water, and a laser direct structuring additive. Further provided are a kit that includes the composition for forming a laser direct structuring layer, and a method for producing a resin molded article with a plating layer.
申请公布号 WO2016002660(A1) 申请公布日期 2016.01.07
申请号 WO2015JP68536 申请日期 2015.06.26
申请人 MITSUBISHI ENGINEERING-PLASTICS CORPORATION 发明人 SUGIYAMA MASAHIDE;YAMADA RYUSUKE;KIKUCHI TATSUYA;YAMANAKA YASUSHI
分类号 C23C18/20;C08L101/12 主分类号 C23C18/20
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