发明名称 JOINING MATERIAL AND JOINT BODY
摘要 PROBLEM TO BE SOLVED: To provide a joining material which enables formation of a joint body in an inert atmosphere, like nitrogen, and exerts sufficiently practical joining strength without heat treatment operation at high temperatures.SOLUTION: A joining material comprises siver nano-particles of an average primary particle size of 1-200 nm coated with an 8C or lower fatty acid, silver particles of an average particle size of 0.5-10 μm, an organic substance having two or more carboxyl groups and a dispersant.
申请公布号 JP2016000861(A) 申请公布日期 2016.01.07
申请号 JP20150146197 申请日期 2015.07.23
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 KURITA TORU;ENDO KEIICHI;SAITO HISASHI;KUEDA MINORU;KAMIYAMA TOSHIHIKO
分类号 B22F1/00;B22F1/02;B23K1/00;H01L21/52;H05K3/32 主分类号 B22F1/00
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