发明名称 |
JOINING MATERIAL AND JOINT BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a joining material which enables formation of a joint body in an inert atmosphere, like nitrogen, and exerts sufficiently practical joining strength without heat treatment operation at high temperatures.SOLUTION: A joining material comprises siver nano-particles of an average primary particle size of 1-200 nm coated with an 8C or lower fatty acid, silver particles of an average particle size of 0.5-10 μm, an organic substance having two or more carboxyl groups and a dispersant. |
申请公布号 |
JP2016000861(A) |
申请公布日期 |
2016.01.07 |
申请号 |
JP20150146197 |
申请日期 |
2015.07.23 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
KURITA TORU;ENDO KEIICHI;SAITO HISASHI;KUEDA MINORU;KAMIYAMA TOSHIHIKO |
分类号 |
B22F1/00;B22F1/02;B23K1/00;H01L21/52;H05K3/32 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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