| 摘要 |
PROBLEM TO BE SOLVED: To provide a cyanogen-based electrolytic gold plating bath which forms a gold bump of a film hardness of 70-120 HV.SOLUTION: A cyanogen-based electrolytic gold plating bath for bump formation is prepared by adding a gold cyanide salt as, a gold source, to a gold concentration of 0.1-15 g/L, an oxalate to a concentration, converted to oxalic acid, of 2.5-50 g/L, an inorganic acid conductive salt to a concentration of 5-100 g/L, a water-soluble polysaccharide to a concentration of 0.1-50 g/L and a crystal adjustment agent to a concentration, converted to the metal concentration, of 1-100 mg/L. The water-soluble polysaccharide is preferably dextrin, α-cyclodextrin, &bgr;-cyclodextrin or dextran. |
