Ball Grid Array Rework

摘要

Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

主权项

1. A method comprising:
placing an expansion material between a ball grid array (BGA) package assembled in communication with a printed circuit board, including the expansion material placed interstitially within a matrix of solder joints between the BGA package and the printed circuit board; controlling a tensile force applied between a ball grid array (BGA) package and the printed circuit board, including delivering electric current to the expansion material; and the electric current creating localized heating of the expansion material; the heated material applying an expansion force to the solder joints, including separation of the BGA from the printed circuit board.