SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the first circuit and the second circuit to each other, a substrate on which the semiconductor chip is disposed, and substrate wirings that are arranged on the substrate and electrically connect the first circuit and the second circuit to each other.

主权项

1. A semiconductor device comprising:
a semiconductor chip comprising a first internal wiring, a first connection pad that is electrically connected to the first internal wiring and exposed to an outside of the semiconductor chip, and a first input pad that is spaced apart from the first connection pad; a substrate on which the semiconductor chip is disposed; and a first substrate wiring that is arranged on the substrate and electrically connects the first connection pad and the first input pad to each other.