| 发明名称 |
SYSTEM AND METHOD FOR ATTACHING SOLDER BALLS AND POSTS IN ANTENNA AREAS |
| 摘要 |
Aspects of the present disclosure provide an apparatus for wireless communications. The apparatus generally includes a printed circuit board (PCB) and a plurality of antenna elements. Each of the plurality of antenna elements is mechanically attached to a perimeter of the PCB via one or more solder elements. Each of the solder elements are spaced apart from each other and electrically isolated from each other in a vicinity of the antenna elements. |
| 申请公布号 |
US2016006133(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514754823 |
申请日期 |
2015.06.30 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
GANCHROW Elimelech;YEHEZKELY Alon |
| 分类号 |
H01Q21/28;H01Q21/00;H01Q1/24 |
主分类号 |
H01Q21/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for wireless communication, comprising:
a printed circuit board (PCB); and a plurality of antenna elements, each mechanically attached to a perimeter of the PCB via one or more solder elements, wherein the solder elements are spaced apart and electrically isolated from each other in a vicinity of the antenna elements. |
| 地址 |
San Diego CA US |
