| 发明名称 |
MICROMETER SCALE COMPONENTS |
| 摘要 |
Micrometer scale components comprise a component body comprising an alloy of a first solder metal and a second solder metal, the alloy having a higher liquidus temperature than the second solder metal; and a base region of the structure body wetted to a substrate, wherein the component body has a molded surface profile. |
| 申请公布号 |
US2016005427(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514853531 |
申请日期 |
2015.09.14 |
| 申请人 |
Western Digital (Fremont), LLC |
发明人 |
LIU ZONGRONG;WANG LEI |
| 分类号 |
G11B5/31 |
主分类号 |
G11B5/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A micrometer scale component, comprising:
a component body comprising an alloy of a first solder metal and a second solder metal, the alloy having a higher liquidus temperature than the second solder metal; and a base region of the structure body wetted to a substrate, wherein the component body has a molded surface profile. |
| 地址 |
Fremont CA US |
