发明名称 METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT
摘要 Provided is a method for manufacturing a multilayer electronic component that can form insulating parts while suppressing overlapping even when distances between adjacent internal electrodes are small and thus can suppress occurrences of differences in levels during layering. This method for manufacturing the layered electronic component has an insulating part (20) in a region outside of a region wherein internal electrodes (15) are formed in a ceramic green sheet (11). A plurality of insulating films (16a) are formed by supplying insulating paste (16) while keeping a prescribed gap open in regions between adjacent internal electrodes (15) such that the internal electrodes (15) partially overlap. The plurality of insulating films (16a) are made to flow by layering and pressing ceramic green sheets (11) on which the plurality of insulating films (16a) have been formed, and the plurality of insulating films (16a) form the insulating part (20) as a unit in regions outside of the regions where the internal electrodes (15) are formed.
申请公布号 WO2016002789(A1) 申请公布日期 2016.01.07
申请号 WO2015JP68849 申请日期 2015.06.30
申请人 MURATA MANUFACTURING CO.,LTD. 发明人 GOTO SEIJI
分类号 H01G4/30;H01F41/12;H01G4/12 主分类号 H01G4/30
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