HIGH HEAT-RESISTANT POLYAMIC ACID SOLUTION AND POLYIMIDE FILM

摘要

The present invention relates to a high heat-resistant polyamic acid solution and a polyimide film, and can provide a polyimide film which has improved heat dimensional stability by comprising a polyamic acid solution containing a polymer of a diamine compound and a dianhydride, the polymer containing a diamine compound having a carboxyl functional group in 1mol% to 10mol% on the basis of the total content of diamines; and, as an imide thereof, a polyimide in which main chains are cross-linked therebetween via an amide linkage.