OPTICAL INTERCONNECTION DEVICE

摘要

Signal transmission crosstalk between substrates is suppressed even when light emitting elements or light receiving elements are densely arranged. Provided is an optical interconnection device 1 in which optical signals are sent and received between a plurality of semiconductor substrates arranged in a laminated manner. A light emitting element 2 or a light receiving element 3 arranged in one semiconductor substrate 10 includes a pn junction part 10pn that uses the semiconductor substrate 10 as a common semiconductor layer, and is formed on one surface side of the semiconductor substrate 10. For a pair of the light emitting element 2 and the light receiving element 3 respectively sending and receiving optical signals between the different semiconductor substrates 10, light emitted by the light emitting element 2 is transmitted through the semiconductor substrate 10 and received by the light receiving element 3.