STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES

摘要

A method for fabricating a semiconductor device package provides a metallic leadframes with a plurality of device sites. Each site including a pad and a plurality of leads with solderable surfaces. At least one set of leads are aligned in a row and are connected by rails to respective leads of an adjacent site. The leads and rails of the row having a surface in a common plane. The strip with the assembled sites and connecting rails are encapsulated in a packaging material, leaving the common-plane lead and rail surfaces un-encapsulated. Trenches are cut between adjacent sites by removing packaging material until reaching the rails. Thus, creating sidewalls of device packages connected by rails. Device packages are singulated from the strip by severing the connecting rails between adjacent sites in approximate halves, leaving a respective rail half as a straight protrusion attached to each lead. The protrusions are bent at an angle away from the common plane towards the package sidewall.