发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device using an oxide semiconductor with stable electrical characteristics and to provide the semiconductor device with high reliability.SOLUTION: The method of manufacturing a semiconductor device comprises the steps of: forming a first insulating film; forming a source electrode, a drain electrode, and an oxide semiconductor film electrically connecting the source electrode and the drain electrode; forming a second insulating film on the oxide semiconductor film in which hydrogen atoms in the film are removed by heat treatment; and forming a gate electrode in a region overlapping the oxide semiconductor film on the second insulating film by performing oxygen doping treatment to the second insulating layer to supply oxygen atoms to the second insulating film.
申请公布号 JP2016001747(A) 申请公布日期 2016.01.07
申请号 JP20150153114 申请日期 2015.08.03
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L21/336;G09F9/30;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115;H01L27/146;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/336
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