THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION BONDERS, AND INTERCONNECT METHODS FOR FINE PITCH FLIP CHIP ASSEMBLY

摘要

A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to a conductive contact of the substrate prior to bonding the semiconductor element to the substrate.