| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a packaged device applicable to a larger number of devices without requiring any special technique or device, and capable of establishing electrical connection with good yield when bonding, and to provide a method of manufacturing a package material.SOLUTION: A packaged device 1 is formed by bonding a device substrate 10 and a package material 20 on which via wiring 21 is disposed. A porous portion 22 integrated with the via wiring 21 is provided on the side of the package material 20 abutting against the counter surface of the device substrate 10. The device substrate 10 and the package material 20 are bonded while facing the protruding pads 12 for wiring connection connected with the device and the porous portion 22. Consequently, the porous portion 22 collapses to become a connection relay part 24, which ensures conduction of the device and the via wiring 21.</p> |
