| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder material which can suppress the occurrence of solidification and shrinkage cracking, and to provide a semiconductor device using the same. <P>SOLUTION: The solder material 4 has a composition in which a solid phase ratio is 30% or higher at the temperature immediately above a solidus. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
