发明名称 パシベーション膜が積層された基板のアブレーション加工方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an ablation method for a passivation film-laminated substrate, capable of preventing diffusion of energy and reflection of a laser beam. <P>SOLUTION: The ablation method for a passivation film-laminated substrate comprises applying a laser beam to the substrate on which the passivation film formed of oxides is laminated to perform ablation. The method includes: a protective film-forming step of applying a liquid resin containing the fine powder of oxides having absorptivity to the wavelength of the laser beam to at least a subject area of the substrate to be ablated, to form a protective film containing the fine powder; and a laser processing step of applying the laser beam to the area of the substrate on which the protective film is formed, thereby performing ablation after performing the protective film-forming step. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5839392(B2) 申请公布日期 2016.01.06
申请号 JP20110221718 申请日期 2011.10.06
申请人 株式会社ディスコ 发明人 北原 信康
分类号 B23K26/36;B23K26/00;B23K26/18;B28D5/00;H01L21/301 主分类号 B23K26/36
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