| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent an adhesive layer from being peeled from a cohesive layer of an adhesive tape. <P>SOLUTION: There is provided a wafer processing tape 1 in which a peeling film 2, an adhesive layer 3, a cohesive layer 41, and a base material film 42 are laminated in this order, and an adhesive tape 4 including the base material film and the cohesive layer covers the adhesive layer and being in contact with the peeling film around the adhesive layer. A marking M is formed so as to straddle a boundary line R between the adhesive layer and the cohesive layer from the base material film side on the adhesive layer, and the adhesive layer and the cohesive layer are fused or welded by the marking. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
