| 摘要 |
<p>Disclosed is a curable composition that exhibits a low viscosity before curing, rapidly cures upon heating, and can form a cured resin that has a low Abbe number of 30 or less, is highly transparent and heat-resistant, and is resistant to yellowing even under high-temperature conditions, such as reflow soldering. Also disclosed are: the cured resin obtained by curing the aforementioned curable composition; and an optical member comprising said cured resin. The disclosed curable resin composition is characterized by containing the belowmentioned components (A and B) in a weight ratio (A:B) between 70:30 and 99:1 and also containing a thiol compound. Component A is a compound that contains a fluorene ring and two (meth)acryloyloxy groups per molecule, and component B is a compound that does not contain a fluorene ring and contains at least one vinyl group or (meth)acryloyloxy group per molecule.</p> |
