EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT

摘要

According to the present invention, a laminated ceramic electronic component for embedding a substrate comprises: a ceramic body including a dielectric layer, and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second cross sections facing each other; first and second internal electrodes alternately exposed to the first and second cross sections of the ceramic body with the dielectric layer therebetween; and first and second external electrodes including connection surfaces disposed on the first and second cross sections of the ceramic body and individually connected to the first and second internal electrodes, and band surfaces extending to at least a part of the first and second main surfaces. The connection surfaces and band surfaces of the first and second external electrodes are made of a conductive thin film, and a width of the band surface is longer than a distance between an end of the first internal electrode and the second cross section or a distance between an end of the second internal electrode and the first cross section.