| 摘要 |
The present invention provides a technology which can promote miniaturization and low magnification of a coil module, promote improvement of a radiation property of the coil module at low costs, and also simply form an external connection terminal of the coil module. Since a wiring electrode pattern (16) of a board side, which is a part of a coil electrode (12), is formed on a wiring board (2), the miniaturization and low magnification of the coil module (1) can be promoted in comparison to a coil module which is formed as an existing coil component is mounted on the wiring board, and heat, generated in a coil (10), can be efficiently sent to the wiring board (2) from the wiring electrode pattern (16) of a board side. Therefore, the improvement of a radiation property of the coil module (1) can be promoted at low costs. In addition, the external connection terminal of the coil module can be simply formed by each first terminal electrode by only laminating insulation boards where a wiring electrode for an external connection is formed on the circumferential surface of one side of a core board. |
