发明名称 CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR POLISHING TUNGSTEN
摘要 The present invention relates to a chemical-mechanical polishing composition and a method for polishing tungsten. More specifically, the present invention provides a composition and a method for tungsten comprising: a metal oxide abrasive; an oxidizer; a substance for improving a tungsten removal rate according to chemical formula I; and water, wherein the polishing composition has an improved tungsten removal rate and shows an increase in the tungsten removal rate.
申请公布号 KR20160001684(A) 申请公布日期 2016.01.06
申请号 KR20150090589 申请日期 2015.06.25
申请人 ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 GUO YI;LAVOIE JR. RAYMOND L.
分类号 C09K3/14 主分类号 C09K3/14
代理机构 代理人
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