发明名称 |
CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR POLISHING TUNGSTEN |
摘要 |
The present invention relates to a chemical-mechanical polishing composition and a method for polishing tungsten. More specifically, the present invention provides a composition and a method for tungsten comprising: a metal oxide abrasive; an oxidizer; a substance for improving a tungsten removal rate according to chemical formula I; and water, wherein the polishing composition has an improved tungsten removal rate and shows an increase in the tungsten removal rate. |
申请公布号 |
KR20160001684(A) |
申请公布日期 |
2016.01.06 |
申请号 |
KR20150090589 |
申请日期 |
2015.06.25 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
GUO YI;LAVOIE JR. RAYMOND L. |
分类号 |
C09K3/14 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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