| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an Sn or Sn alloy plated material in which production of powder upon pressing is suppressed, and which has low contact resistance and high solder wettability, and maintains these characteristics even after heating for a long period of time, and a method for producing the same. <P>SOLUTION: The Sn or Sn alloy plated material 10 includes: a metallic base material 11; Sn or Sn alloy plating 13 formed on the metallic base material 11; and a surface treatment layer 14 formed on the Sn or Sn alloy plating 13. The plating thickness of the Sn and Sn alloy plating 13 is≥0.2μm. When element analysis of the surface of the surface treatment layer is performed by the Survey measurement of XPS (X-ray Photoelectron Spectroscope), the peak of the binding energy (P2S) of the 2S orbit of phosphor (P) is 186 to 192 eV, and P is included by 0.5 to <5.0%, while the peak of the binding energy (C1S) of the 1S orbit of carbon (C) is 284 to 290 eV, and C is included by 35 to <80 at%. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
