发明名称 パシベーション膜が積層された基板のアブレーション加工方法
摘要 <p>An ablation method of applying a laser beam to a substrate on which a passivation film of nitride is formed, thereby performing ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a fine powder of oxide having absorptivity to the wavelength of the laser beam to at least a subject area of the substrate to be ablated, thereby forming a protective film containing the fine powder on at least the subject area of the substrate, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the substrate after performing the protective film forming step.</p>
申请公布号 JP5839923(B2) 申请公布日期 2016.01.06
申请号 JP20110221721 申请日期 2011.10.06
申请人 株式会社ディスコ 发明人 北原 信康
分类号 B23K26/36;B23K26/00;B23K26/18 主分类号 B23K26/36
代理机构 代理人
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