| 摘要 |
<p>An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (6), (B) a bonding material (5), (C) a cured film obtained by curing a photosensitive resin composition (4), and (D) a flexible printed circuit board (1) are laminated in this order.</p> |
