发明名称 |
MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL CIRCUIT COMPONENTS WITHIN A THREE DIMENSIONAL MODULE |
摘要 |
A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers. |
申请公布号 |
EP2813132(A4) |
申请公布日期 |
2016.01.06 |
申请号 |
EP20130746884 |
申请日期 |
2013.02.06 |
申请人 |
CRANE ELECTRONICS, INC. |
发明人 |
PARKER, ERNEST, CLYDE;LAURIELLO, PHILIP, JOSEPH |
分类号 |
H05K3/46;H01L23/12;H05K1/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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