| 摘要 |
<p>The invention provides a semiconductor and a manufacturing method thereof. The semiconductor (50) is provided with a base plate provided with an external connecting terminal (12), a controller (4) carried on the first side (2a) of the base plate (2), a first spacing member (6a) made of resin and configured at one side of the controller (4), a second spacing member (6b) made of resin and carried on the opposite side of the first spacing member across over the controller (4), a storing chip (8) carried between the first spacing member and the second spacing member by spanning over the first spacing member and the second spacing member, a cavity (18) enclosed by the storing chip, the first spacing member, the second spacing member, and the base plate, and a resin moulding part (10) arranged surrounding the storing chip for sealing. Therefore, the equaling and/or shortening of the wiring connecting the controller and the external connecting terminal and/or the wiring connecting the controller and the storing chip can be realized, and the bending and curving of products can be suppressed.</p> |
