发明名称 ハンダ曲がり検出装置
摘要 <p><P>PROBLEM TO BE SOLVED: To detect a state of solder. <P>SOLUTION: A solder state detection device includes an electrode arranged at a side of a solder supply position at which solder is supplied from a solder supplying part, and capacitance value acquiring means for acquiring a capacitance value between the electrode and solder supplied from the solder supplying part. An operation part is provided, which determines a state of solder supplied from the solder supplying part on the basis of the capacitance value acquired by the capacitance value acquiring means. Thus, the state of the solder can be detected with no contact. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5838580(B2) 申请公布日期 2016.01.06
申请号 JP20110073111 申请日期 2011.03.29
申请人 富士通株式会社 发明人 原田 徹;高田 英治
分类号 G01B7/28;B23K1/00;B23K3/06;G01B7/14 主分类号 G01B7/28
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