| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of sufficiently washing the entire surface of a substrate. <P>SOLUTION: A substrate processing apparatus 1 includes a spin chuck 2 for holding and rotating a substrate, and a nozzle 4 for discharging droplets of process liquid toward a substrate W held by the spin chuck 2. On the nozzle 4, a plurality of lines L1 for which a plurality of discharge ports 33 for discharging the droplets of the process liquid are arranged in one line are arranged. The nozzle 4 is held by a nozzle arm 18, and is moved along a track X1 passing through a rotation center C1 of a main surface of the substrate W in the view from a vertical direction D1 vertical to the main surface of the substrate W held by the spin chuck 2. The nozzle 4 is held by the nozzle arm 18 such that the plurality of lines L1 and the track X1 cross in the view from the vertical direction D1. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
