CURABLE RESIN COMPOSITION, AND IMAGE-SENSOR-CHIP PRODUCTION METHOD AND IMAGE SENSOR CHIP USING SAME

摘要

To provide a curable resin composition capable of producing an image sensor chip in which the color shading is suppressed, a production method of image sensor chip using the same, and an image sensor chip. A curable resin composition which is capable of being coated so as to have a film thickness of 20 µm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm.