发明名称 シリカ粒子、その製造方法および半導体実装用ペースト
摘要 <p><P>PROBLEM TO BE SOLVED: To provide silica particles which scarcely dischargeα-rays, which is excellent in dispersibility to a resin, and which can be contained in a paste for semiconductor packaging. <P>SOLUTION: The silica particles have an average particle size of 10 nm to 10μm measured by dynamic light scattering, wherein the ratio (U/SiO<SB POS="POST">2</SB>) of mass of uranium to mass of silicon oxide (in terms of SiO<SB POS="POST">2</SB>) is 2 ppb or less, the ratio (Th/SiO<SB POS="POST">2</SB>) of mass of thorium to mass of silicon oxide (in terms of SiO<SB POS="POST">2</SB>) is 2 ppb or less, and the ratio (alkali metal element/SiO<SB POS="POST">2</SB>) of mass of alkali metal elements to mass of silicon oxide (in terms of SiO<SB POS="POST">2</SB>) is 10 to 1,000 ppm. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5840476(B2) 申请公布日期 2016.01.06
申请号 JP20110276231 申请日期 2011.12.16
申请人 日揮触媒化成株式会社 发明人 熊澤 光章;宮本 卓児;若宮 義徳;荒尾 弘樹
分类号 C01B33/193;C08K3/36;C08L101/00;H01L21/52;H01L23/29;H01L23/31 主分类号 C01B33/193
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