Lead-free glass for semiconductor encapsulation

摘要

The technical task of the present invention is to provide a lead-free glass for semiconductor encapsulation, which is easy to automate an appearance inspection, and furthermore, has excellent refinability and encapsulatability of semiconductor devices. In the lead-free glass for semiconductor encapsulation according to the present invention, a temperature at which the viscosity of glass is 106 dPa·s is 670° C. or lower, and, as a glass composition, the content of CeO2 is from 0.01 to 6% by mass, and the content of Sb2O3 is 0.1% by mass or less.

主权项

1. A lead-free glass for semiconductor encapsulation, wherein a temperature at which the viscosity of glass is 106 dPa·s is 670° C. or lower, and, as a glass composition, the content of CeO2 is from 0.01 to 4% by mass, the content of Sb2O3 is 0.1% by mass or less, the content of SiO2 is from 20 to 65% by mass, the content of Bi2O3 is 0 to 20% by mass, the content of B2O3 is from 14 to 40% by mass, and the glass further comprises a total content of R2O from 14.7 to 22% by mass, wherein R2O is Li2O, Na2O, and K2O.