Optical module

摘要

An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

主权项

1. An optical module, comprising:
a circuit board; a photoelectric conversion element mounted on the circuit board; an optical connector for optically connecting the photoelectric conversion element and an optical fiber; a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element; a rod-shaped elastic pressing member for pressing and fixing the optical connector to the circuit board; and a supporting member for supporting the rod-shaped elastic pressing member, wherein the circuit board comprises a plurality of electrodes on a non-mounting surface that is opposite to a mounting surface with the semiconductor circuit element mounted thereon, wherein the supporting member comprises an attaching portion to be fixed to a counterpart board that has a plurality of counterpart electrodes electrically connected to the plurality of electrodes, wherein the rod-shaped elastic pressing member comprises a supported portion to be supported by the supporting member so as to pivot about the supported portion, wherein the supporting member comprises a fixing portion for fixing the rod-shaped elastic pressing member in a state that the optical connector is pressed by the rod-shaped elastic pressing member, wherein the supporting member comprises a heat-absorbing surface and a heat-dissipating surface, wherein the heat-absorbing surface is thermally connected to the semiconductor circuit element, and wherein the heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.