Image sensor package

摘要

An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.

主权项

1. A package for an image sensor, comprising:
a first substrate comprising an upper surface and a lower surface opposite the upper surface; a via formed in the first substrate; a driving circuit formed on the upper surface of the first substrate and electrically connected to the via; a second substrate comprising a first surface and a second surface opposite the first surface, wherein the second substrate is bonded to the first substrate through conductive pads, a photosensitive device is formed on the first surface of the second substrate, and the photosensitive device is electrically connected to the driving circuit; a support member formed on the second surface of the second substrate; a covering plate disposed on the second surface of the second substrate; and a solder ball formed on the lower surface of the first substrate and electrically connected to the via.