发明名称 |
LCOS panel and method of manufacturing the same |
摘要 |
A method of manufacturing LCOS panel is disclosed. The method includes: providing a silicon substrate on which at least one conductive pad is formed and a transparent substrate on which a transparent electrode layer is formed; dispensing or coating a sealing material on a predetermined area of the silicon substrate or the transparent substrate; bonding the silicon substrate with the transparent substrate; singulating the bonded silicon substrate and transparent substrate such that at least one space is provided between the silicon substrate and the transparent substrate on an outer side of the sealing material and a part of the transparent electrode layer is exposed in the space; and dispensing a conductive adhesive into the space to connect the transparent electrode layer to the conductive pad. The method is able to achieve a smaller-size of the LCOS panels, a higher production yield and a lower process requirement. |
申请公布号 |
US9229280(B2) |
申请公布日期 |
2016.01.05 |
申请号 |
US201313865835 |
申请日期 |
2013.04.18 |
申请人 |
OMNIVISION TECHNOLOGIES (SHANGHAI) CO., LTD. |
发明人 |
Fan Regis |
分类号 |
G02F1/1339;G02F1/1333;G02F1/1362;G02F1/1341;G02F1/1337;G02F1/1345 |
主分类号 |
G02F1/1339 |
代理机构 |
Blakely Sokoloff Taylor & Zafman LLP |
代理人 |
Blakely Sokoloff Taylor & Zafman LLP |
主权项 |
1. A method of manufacturing liquid crystal on silicon (LCOS) panel, comprising the following steps in the sequence set forth:
providing a silicon substrate and a transparent substrate, the silicon substrate having at least one conductive pad formed thereon, the transparent substrate having a transparent electrode layer formed thereon; dispensing or coating a sealing material on a predetermined area of the silicon substrate or the transparent substrate; bonding the silicon substrate with the transparent substrate; singulating the bonded silicon substrate and transparent substrate such that at least one space is provided between the silicon substrate and the transparent substrate on an outer side of the sealing material, a part of the transparent electrode layer being exposed in the space; and dispensing a conductive adhesive into the space to connect the transparent electrode layer to the conductive pad. |
地址 |
Shanghai CN |