Resilient conductive electrical interconnect

摘要

An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.

主权项

1. An interconnect assembly comprising: a resilient material printed to include a plurality of through holes extending from a first surface to a second surface and a plurality of recesses located along at least one of the first and second surfaces corresponding to desired circuit traces; a plurality of discrete, free-flowing conductive particles located in the through holes, the conductive particles being free of binders or non-conductive materials; a plurality of first contact tips located in the through holes adjacent the first surface; a plurality of second contact tips located in the through holes adjacent the second surface; and a conductive material printed in at least a portion of the recesses comprising conductive traces electrically coupled to one or more of the contact tips, wherein the contact tips are solid and non-spherical and move in at least the pitch and roll directions relative to the interconnect assembly.