Methods of forming serpentine thermal interface material and structures formed thereby

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.

主权项

1. A method of forming a thermal interface material (TIM) comprising:
forming a first interface material on a substrate; placing a serpentine foil on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern; and forming a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with and extends into at least one of the first and second interface materials.