发明名称 Liquid ejecting apparatus
摘要 A liquid ejecting apparatus includes: a liquid ejecting head for ejecting liquid; a first flow path through which liquid is supplied from a first container provided at an upstream to the liquid ejecting head provided at a downstream; a second flow path that forms a circulation flow path in which the liquid is capable of circulating through the circulating flow path including the first flow path and the second flow path; and a third flow path through which liquid is supplied from a second container provided at an upstream to the circulation flow path provided at a downstream, and a downstream end of the third flow path is coupled to one of the second flow path and a section on an upstream side of the downstream joint with the second flow path in the first flow path.
申请公布号 US9227414(B2) 申请公布日期 2016.01.05
申请号 US201414168985 申请日期 2014.01.30
申请人 Seiko Epson Corporation 发明人 Ichihara Keita
分类号 B41J2/175;B41J2/18 主分类号 B41J2/175
代理机构 Workman Nydegger 代理人 Workman Nydegger
主权项 1. A liquid ejecting apparatus comprising: a liquid ejecting head for ejecting liquid; a first flow path through which liquid is supplied from a first container provided at an upstream to the liquid ejecting head provided at a downstream; a second flow path that forms a circulation flow path by coupling an upstream end thereof to an upstream joint of the first flow path and by coupling a downstream end thereof to a downstream joint of the first flow path, the liquid being capable of circulating through the circulation flow path including the second flow path and a section between the upstream joint and the downstream joint in the first flow path; and a third flow path through which liquid is supplied from a second container provided at an upstream to the liquid ejecting head and an upstream to the circulation flow path provided at a downstream, wherein a downstream end of the third flow path is coupled to one of the second flow path and a section of an upstream side of the downstream joint in the first flow path.
地址 Tokyo JP