发明名称 |
sistema e método de ligação de um adesivo reativo à pelo menos um substrato |
摘要 |
The invention is a system, or kit, comprising i) a stable solution or dispersion of a catalyst for the curing of a reactive adhesive system; and in a separate part ii) an uncured reactive adhesive system wherein the catalyst of part i) accelerates the cure of the reactive adhesive system. The reactive adhesive system can be a one or two-part system. In another embodiment, the invention is a method of bonding a reactive adhesive to a substrate comprising: a) contacting a catalyst for the curing of the reactive adhesive in a volatile solvent with the surface of the substrate to which the adhesive will be bonded; b) allowing the volatile solvent to volatilize away; c) contacting a reactive adhesive with the surface treated in step a) and d) allowing the adhesive to cure. This process is performed in the absence of a primer and a film forming agent. |
申请公布号 |
BRPI0913143(A2) |
申请公布日期 |
2016.01.05 |
申请号 |
BR2009PI13143 |
申请日期 |
2009.08.28 |
申请人 |
DOW GLOBAL TECHNOLOGIES LLC |
发明人 |
RENATE HERGER HASSAN;ULRICH TRIBELHORN |
分类号 |
C08G18/10;C09J5/02;C09J175/08 |
主分类号 |
C08G18/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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