Semiconductor devices having through-substrate via plugs and semiconductor packages including the same

摘要

Provided is a semiconductor package including a package substrate having lands, a first semiconductor device mounted on the package substrate and having a bottom surface on which first lines are disposed, and solder balls respectively electrically connected to the lands of the package substrate with the first lines of the first semiconductor device. The first semiconductor device includes a first substrate, and through-substrate via (TSV) plugs that vertically pass through the first substrate. The TSV plugs are respectively vertically aligned with the first lines, overlap first regions corresponding to 70% or less of diameters of the solder balls from central axes of the solder balls, and do not overlap second regions corresponding to the remaining 30% or more of diameters of the solder balls from the central axes of the solder balls. Adjacent ones of the TSV plugs are arranged at irregular intervals with respect to each other.

主权项

1. A semiconductor package comprising:
a package substrate having lands; a first semiconductor chip mounted on the package substrate, and including a first substrate, through-substrate via plugs vertically passing through the first substrate, first lines on a bottom surface on the first substrate and through-substrate via pads on a top surface of the first substrate; and solder balls respectively electrically connected to the lands of the package substrate and the first lines of the first semiconductor chip, wherein the through-substrate via pads are respectively vertically aligned with the through-substrate via plugs, wherein the through-substrate via plugs include first through-substrate via plugs which are respectively vertically aligned with the first lines and overlap first regions corresponding to 70% or less of diameters of the solder balls from central axes of the solder balls, and second through-substrate via plugs which are arranged so that each first through-substrate via plug has a corresponding adjacent second through-substrate via plug and which do not overlap second regions corresponding to the remaining 30% or more of diameters of the solder balls from the central axes of the solder balls, and wherein a first distance between first and second through-substrate via plugs of a first pair of the through-substrate via plugs is different from a second distance between first and second through-substrate via plugs of a second pair of the through-substrate via plugs.