Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling

摘要

A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when the cover wafer is bonded to the device wafer.

主权项

1. A structure for detecting electromagnetic radiation having a predetermined wavelength, comprising: a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation; a cover wafer having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a r:mrfoce of the sensing element; a bond gap spacer structure for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a predetermined distance less than a fraction of the predetermined wavelength when the cover wafer is bonded to the device wafer, wherein the bond gap spacer forms a gap between the surface of the sensing element and the opposing surface of the transparent region of the cover wafer to enable evanescent wave coupling across the gap.