发明名称 Sensor chip, detection device, and method of manufacturing sensor chip
摘要 A sensor chip includes a substrate, a relief structure composed of protruding sections formed so as to be arranged on a surface of the substrate to have a lattice shape and a recessed section between the protruding sections, and fine metal particles arranged along upper ridge lines of the respective protruding sections of the relief structure, the protruding sections being adjacent to each other, having a minute gap with which the surface plasmon resonance occurs. By irradiating the gap between the fine metal particles with a laser beam, the localized surface plasmon resonance occurs more efficiently. As a result, the sensor chip capable of taking out the surface enhanced Raman scattering to thereby detect the substance with high sensitivity can be realized.
申请公布号 US9228945(B2) 申请公布日期 2016.01.05
申请号 US201113334861 申请日期 2011.12.22
申请人 Seiko Epson Corporation 发明人 Sakagami Yusuke
分类号 G01N21/552;G01J3/44;G01N21/65;H01L27/144 主分类号 G01N21/552
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A sensor chip comprising: a substrate; a relief structure arranged on an uneven surface of the substrate, the relief structure having a recessed section, protruding sections located on both sides of the recessed section, the protruding sections having upper ridgelines; and a plurality of fine metal particles that each have a spherical shape, each of the plurality of fine metal articles abutting two adjacent upper ridgelines, wherein the plurality of fine metal particles are spaced apart from one another so that a gap is formed between at least a part of the plurality of fine metal particles, the recessed section in the relief structure is configured with a plurality of groove elements in a plan view.
地址 JP