| 发明名称 | Vibration isolation interposer die | ||
| 摘要 | In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections. | ||
| 申请公布号 | US9227835(B2) | 申请公布日期 | 2016.01.05 |
| 申请号 | US201113299485 | 申请日期 | 2011.11.18 |
| 申请人 | Honeywell International Inc. | 发明人 | Horning Robert D.;Supino Ryan |
| 分类号 | B81B7/00 | 主分类号 | B81B7/00 |
| 代理机构 | Fogg & Powers LLC | 代理人 | Fogg & Powers LLC |
| 主权项 | 1. An interposer chip comprising: a die including: a base portion;a chip mounting portion;one or more flexures connecting the base portion to the chip mounting portion;a first plurality of projections extending from the base portion towards the chip mounting portion; anda second plurality of projections extending from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections. | ||
| 地址 | Morristown NJ US | ||