| 摘要 |
The present invention relates to a method for cutting a bonded substrate, which removes a unnecessary dummy part of a substrate formed with a sealing portion while leaving the part as narrow as possible during a scribe cutting process of a bonded substrate or the like by using a laser, and also smoothly cuts a cutting surface. The method of the present invention comprises the following steps: forming a cutting line (CL) on an upper glass portion (11a) or a lower glass portion (11b) by scribing the upper glass portion (11a) or the lower glass portion (11b) on the sealing portion (8) with a scribing wheel (60); cutting the sealing portion (8) by irradiating a laser to the sealing portion (8) disposed to be spaced apart at a predetermined interval from the CL formed on the upper glass portion (11a) or the lower glass portion (11b); and cutting the remaining glass portion, on which the CL is not formed, by scribing the same with the scribing wheel (60) after cutting the sealing portion (8). Thus, a neat cutting surface can be formed. |
