| 发明名称 | Flexible metal clad laminate and manufacturing method thereof | ||
| 摘要 | A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards. | ||
| 申请公布号 | US9232660(B2) | 申请公布日期 | 2016.01.05 |
| 申请号 | US201214369128 | 申请日期 | 2012.12.27 |
| 申请人 | SK Innovation Co., Ltd. | 发明人 | Kim Ho Sub;Lee Yong Seok;Choi Weon Jung;Kim Dae Nyoun;Kim Young Do |
| 分类号 | B32B15/08;H05K3/02;H05K1/03 | 主分类号 | B32B15/08 |
| 代理机构 | The Webb Law Firm | 代理人 | The Webb Law Firm |
| 主权项 | 1. A flexible metal clad laminate comprising: a metal foil; and a multilayered polyimide film comprising a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer, the multilayered polyimide film satisfying following Equation 1, C2<C1≦C3 [Equation 1]in which, C1 represents a coefficient of thermal linear expansion of the first polyimide layer, C2 represents a coefficient of thermal linear expansion of the second polyimide layer, and C3 represents a coefficient of thermal linear expansion of the third polyimide layer. | ||
| 地址 | Seoul KR | ||