Adhesiveless copper clad laminates and printed circuit board having adhesiveless copper clad laminates as base material

摘要

Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless copper clad laminates excellent in wiring microfabrication ability as a base material are provided. The adhesiveless copper clad laminates include a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating. The copper plating film contains 10 mass ppm to 150 mass ppm of sulfur in a depth range of at least 0.4 μm from the front surface of the copper plating film in a direction toward the insulating film.

主权项

1. Adhesiveless copper clad laminates comprising
a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating, wherein the copper plating film contains 10 mass ppm to 150 mass ppm of sulfur from the front surface of the copper plating film to a depth of 0.4 μm in a direction toward the insulating film.