Non-uniform substrate stackup

摘要

Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

主权项

1. A routing arrangement comprising: pads to be coupled to a die; a first trace coupled to a first pad among the pads, the first trace having a first thickness; and a second trace coupled to a second pad among the pads, the second trace having a second thickness, wherein the second thickness is different from the first thickness, a third trace having a third thickness equal to the first thickness of the first trace, wherein the first and third traces are located in first same layer of a substrate; and a fourth trace having a fourth thickness equal to the second thickness of the second trace, wherein the second and fourth traces are located in a second layer of a substrate.