Hermetic plastic molded MEMS device package and method of fabrication

摘要

A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).

主权项

1. A hermetically packaged microelectromechanical system (MEMS) device comprising:
a substrate having an assembly pad and a plurality of terminals; a chip assembled on the pad and connected to the terminals by wires having an insulating coat, the chip including a micromechanical element extending a first height above a chip surface; a ridge on the substrate, the ridge surrounding the micromechanical element, the ridge extending above the chip surface by a second height greater than the first height and comprising a plastic compound filled with electrically conductive particles and a ridge surface having an adhering moisture-impermeable seal layer; and a moisture-impervious lid attached to the ridge by moisture-proof bonds, sealing a volume defined by the lid, the chip, and the ridge.