Method for manufacturing an electronic module

摘要

This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

主权项

1. An electronic module comprising:
a first element comprising a first insulating-material layer having a first surface and a second surface, and a first thickness between the first surface and the second surface; a first recess in the first insulating-material layer; a first component in the first recess, the first component having a first height greater than the first thickness; a first conductive pattern layer on the first surface and electrically connected to the first component; and a second conductive pattern layer on the second surface, the first component extending through the second conductive pattern layer; a second element coupled to the first element, the second element comprising a second insulating-material layer having a third surface and a fourth surface, and a second thickness between the third surface and the fourth surface; a second recess in the second insulating-material layer; a second component in the second recess, the second component having a second height greater than the second thickness; a third conductive pattern layer on the third surface and electrically connected to the second component; and a fourth conductive pattern layer on the fourth surface; a third insulating-material layer between the second conductive pattern layer and the fourth conductive pattern layer, wherein the third insulating-material layer fills space between the first element and the second element, and wherein an upper surface of the first component is higher than an upper surface of the second conductive pattern layer.