Package substrate with band stop filter and semiconductor package including the same

摘要

According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.

主权项

1. A package substrate, comprising a band stop filter which comprises:
a transmission line pattern disposed along an outer boundary line on the package substrate; and a conductive stub pattern arranged along the transmission line pattern, wherein the conductive stub pattern is separated from the transmission line pattern.